Analog inductive proximity sensors have been in the automation market for many years, but the linearity, repeatability and accuracy of this category of device hasn’t been what our customers have asked for or needed for more precise applications. New ASICS in these devices and newer technologies in general is now allowing for many tasks to be accomplished with these analog inductive proximity devices. For example, thermal growth measurement (with smaller diameter models), thickness measurement, bend angle measurement (even “on the fly” with servos on die that compensate for spring back and deflection of metals being run through a stamping process), flatness of critical metallic components, etc. can now be measured with confidence.